A good agreement has been achieved between the experimental results and the model. Simulating suchbehavior is computationally very expensive using conventional FE simulation techniques. Abstract Cite Journal article. Consequently, advanced constitutive models are required to reflect the associated temperature and strain rate effects. Stress-strain behavior at various temperatures was investigated and compared with that in traditional hot stamping processes. It is found that both of the stress-state based and strain-state based material models can predict the formability of AA under hot stamping conditions. Quantitative transmission electron microscopy TEM and related small-angle X-ray scattering SAXS analysis have been carried out for selected creep-aged samples to assist the development and calibration of the constitutive model. To overcome these problems, a new forming process has been proposed, which effectively combines AM and compressive forming.
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